Probe systems and methods

ABSTRACT

Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

RELATED APPLICATIONS

This application is a divisional patent application that claims priorityto U.S. patent application Ser. No. 15/708,681, entitled PROBE SYSTEMSAND METHODS, which was filed on Sep. 19, 2017 and issued as U.S. Pat.No. 10,459,006 on Oct. 29, 2019, which claims priority to U.S.Provisional Patent Application No. 62/400,978, entitled PROBE SYSTEMSAND METHODS, which was filed on Sep. 28, 2016, and the completedisclosures of which are hereby incorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure is directed generally to probe systems andmethods, and more particularly to probe systems that include anelectronic component mounted to a manipulator, to probe systems thatinclude direct distance measurement between two manipulated assemblies,and/or to methods of operating the probe systems that include directdistance measurement between the two manipulated assemblies.

BACKGROUND OF THE DISCLOSURE

Probe systems may be utilized to test the operation of a device undertest (DUT), such as a semiconductor device and/or an integrated circuitdevice. As these devices become smaller, and their operating frequenciesincrease, physical distances that test signals must travel becomeincreasingly important and/or have an increasingly significant impact ontest results. For millimeter wave (mmW) tests, which generally areperformed at frequencies between 30 gigahertz (GHz) and 300 GHz, signalpath distances generally must be accounted for, and shorter signal pathsgenerally produce more accurate test results.

It is known to calibrate probe systems in order to validate, or toimprove the accuracy of, test results. In certain testing scenarios,such as mmW tests, calibration and/or test results may be significantlyimpacted by a distance, or an assumed distance, between probes that areutilized to carry out the calibration and/or the tests. In addition,variation of the distance between the probes during calibration, ascompared to during testing, may significantly impact the accuracy of thecalibration, as applied to the test results. Additionally oralternatively, a distance between the DUT and one or more electroniccomponents of the probe system may limit the effectiveness of the probesystem. Thus, there exists a need for improved probe systems andmethods.

SUMMARY OF THE DISCLOSURE

Probe systems and methods are disclosed herein. The methods includeoperatively aligning a first probe of a first manipulated assembly witha first contact location of an electrical structure and operativelyaligning a second probe of a second manipulated assembly with a secondcontact location of the electrical structure. The methods also includedirectly measuring a distance between the first manipulated assembly andthe second manipulated assembly, contacting first and second probes withfirst and second contact locations, providing a test signal to theelectrical structure, and receiving a resultant signal from theelectrical structure. The methods further include characterizing atleast one of a probe system and the electrical structure based upon thedistance between the first manipulated assembly and the secondmanipulated assembly.

In one embodiment, the probe systems include a chuck with a supportsurface configured to support a substrate that includes a device undertest (DUT). In these embodiments, the probe systems also include a probehead assembly. The probe head assembly includes a platen, a firstmanipulator operatively attached to the platen, and a first manipulatedassembly operatively attached to the first manipulator and including afirst probe configured to contact the DUT. The probe head assembly alsoincludes a second manipulator operatively attached to the platen and asecond manipulated assembly operatively attached to the secondmanipulator and including a second probe configured to contact the DUT.In these embodiments, the probe system also includes a measurementdevice configured to directly measure a distance between the firstmanipulated assembly and the second manipulated assembly.

In another embodiment, the probe systems include a probe head assemblyincluding a platen and a manipulator including a manipulator mount,which is operatively attached to the platen, and a probe mount. Themanipulator is configured to selectively and operatively translate theprobe mount relative to the manipulator mount. The probe head assemblyalso includes a vector network analyzer (VNA) extender operativelyattached to the probe mount of the manipulator and a probe operativelyattached to the probe mount via the VNA extender such that themanipulator is configured to operatively translate both the VNA extenderand the probe relative to the manipulator mount via motion of the probemount. In these embodiments, the probe systems also include a chuckhaving a support surface configured to support a substrate that includesa DUT, and the probe faces toward the support surface to permitselective electrical contact between the probe and the DUT. In theseembodiments, the probe system further includes a vector network analyzerconfigured to at least one of provide a test signal to the VNA extenderand receive a resultant signal from the VNA extender.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic illustration of examples of probe systemsaccording to the present disclosure.

FIG. 2 is a less schematic front view illustrating an example of a probesystem according to the present disclosure.

FIG. 3 is a top view of the probe system of FIG. 2.

FIG. 4 is an illustration of a portion of the probe system of FIG. 2.

FIG. 5 is an illustration of a portion of the probe system of FIG. 2.

FIG. 6 is a flowchart depicting methods of utilizing a probe systemaccording to the present disclosure.

DETAILED DESCRIPTION AND BEST MODE OF THE DISCLOSURE

FIGS. 1-6 provide examples of probe systems 20, according to the presentdisclosure, of components of probe systems 20, and/or of methods 300,according to the present disclosure, of utilizing probe systems, such asprobe systems 20. Elements that serve a similar, or at leastsubstantially similar, purpose are labeled with like numbers in each ofFIGS. 1-6, and these elements may not be discussed in detail herein withreference to each of FIGS. 1-6. Similarly, all elements may not belabeled in each of FIGS. 1-6, but reference numerals associatedtherewith may be utilized herein for consistency. Elements, components,and/or features that are discussed herein with reference to one or moreof FIGS. 1-6 may be included in and/or utilized with any of FIGS. 1-6without departing from the scope of the present disclosure. In general,elements that are likely to be included in a particular embodiment areillustrated in solid lines, while elements that are optional areillustrated in dashed lines. However, elements that are shown in solidlines may not be essential and, in some embodiments, may be omittedwithout departing from the scope of the present disclosure.

FIG. 1 is a schematic illustration of examples of probe systems 20according to the present disclosure, while FIGS. 2-5 provide lessschematic examples of probe systems 20 and/or components thereof. Asillustrated schematically in FIG. 1 and less schematically by FIGS. 2-5,probe systems 20 include a probe head assembly 100 including a platen110. Probe head assemblies 100 include a manipulator 120 and may includea plurality of manipulators 120, such as at least a first manipulator121 and a second manipulator 122, as illustrated in FIGS. 1-3. Eachmanipulator 120 may include a manipulator mount 124 and a probe mount126, as illustrated in FIG. 1. Manipulator mount 124 may be operativelyattached to, or may operatively attach corresponding manipulator 120 to,platen 110. In FIGS. 1-3, one or two manipulators 120 are illustrated;however, it is within the scope of the present disclosure that probesystems 20 may include more than two manipulators 120. As examples,probe systems 20 may include three, four, five, six, or more than sixmanipulators 120.

As illustrated collectively by FIGS. 1-5, probe systems 20 also includea manipulated assembly 140, and a corresponding manipulated assembly 140may be associated with, operatively attached to, and/or manipulated by,each manipulator 120. As an example, each manipulated assembly 140 maybe operatively attached to a corresponding probe mount 126 of acorresponding manipulator 120, and the corresponding manipulator may beconfigured to selectively and operatively translate the probe mountrelative to the manipulator mount. As another example, a firstmanipulated assembly 141 may be associated with, operatively attachedto, and/or manipulated by first manipulator 121. Similarly, a secondmanipulated assembly 142 may be associated with, operatively attachedto, and/or manipulated by second manipulator 122. First manipulator 121and second manipulator 122 may be configured to be independentlyactuated and/or to selectively and operatively translate firstmanipulated assembly 141 and second manipulated assembly 142 relative toone another.

Each manipulated assembly 140 may include, or be, a corresponding probe170. As an example, a first probe 171 may be associated with,operatively attached to, and/or manipulated by first manipulator 121.Similarly, a second probe 172 may be associated with, operativelyattached to, and/or manipulated by second manipulator 122.

Manipulated assemblies 140 also may include an electronic component 160.Electronic component 160 also may be referred to herein as, or may be, avector network analyzer (VNA) extender 160, a spectrum analyzer extender160, and/or a signal analyzer extender 160. The following discussiongenerally will refer to VNA extender 160; however, it is to beunderstood that the VNA extender may include and/or instead may be theelectronic component, the spectrum analyzer extender, and/or the signalanalyzer extender. VNA extender 160, when present, may be operativelyattached to a corresponding probe mount 126 of a correspondingmanipulator 120, and a corresponding probe 170 may be operativelyattached to the corresponding manipulator via the VNA extender. As such,VNA extender 160 and the corresponding probe 170 both may be configuredto selectively and operatively translate relative to manipulator mount124, or platen 110, via manipulation of corresponding manipulator 120and/or via motion of corresponding probe mount 126.

As illustrated in dashed lines in FIG. 1, probe systems 20 also mayinclude a chuck 30 that includes a support surface 32. Support surface32 may be configured to support a substrate 40, and substrate 40 mayinclude one or more devices under test (DUTs) 42 and/or one or more teststructures 44. Probe system 20 further may include a translation stage34, which may be configured to operatively translate chuck 30 along anX-axis, a Y-axis, and/or a Z-axis. Additionally or alternatively,translation stage 34 also may be configured to rotate chuck 30 about theX-axis, the Y-axis, and/or the Z-axis.

As also illustrated in dashed lines in FIG. 1, probe system 20 mayinclude a controller 90. Controller 90 also may be referred to hereinas, may include, and/or may be a control system 90 and/or a signalgeneration and analysis assembly 90 and may be configured to test and/orquantify the operation of DUT 42. As an example, the controller may beconfigured to provide a test signal 82 to the DUT and/or to receive aresultant signal 84 from the DUT. The test signal and/or the resultantsignal may be conveyed between control system 90 and DUT 42 via probehead assembly 100, via chuck 30, and/or via a data cable 80 that extendsbetween the control system and the probe head assembly.

As illustrated in FIG. 1, probes 170 may face toward support surface 32of chuck 30 such that the probes may contact, or electrically contact,DUT 42. As an example, first probe 171 may contact a first contactlocation 46 on DUT 42. As another example, second probe 172 may contacta second contact location 48 on DUT 42. This contact may be selectivelyestablished and/or disrupted via motion of chuck 30, such as viaactuation of translation stage 34, and/or via motion of probes 170, suchas via actuation of manipulators 120.

VNA extender 160, when present, may be configured to receive test signal82 from controller 90 at a first frequency and to provide the testsignal to probe 170 at a second frequency that is greater than the firstfrequency. As such, VNA extender 160 may extend the operating frequencyrange of controller 90. Examples of the first frequency includefrequencies of at most 10 gigahertz (GHz), at most 20 GHz, at most 30GHz, at most 40 GHz, at most 50 GHz, at most 60 GHz, at most 70 GHz,and/or at most 80 GHz. Examples of the second frequency includefrequencies of at least 50 GHz, at least 60 GHz, at least 70 GHz, atleast 80 GHz, at least 90 GHz, at least 100 GHz, at least 200 GHz, atleast 300 GHz, at most 1,000 GHz, at most 800 GHz, at most 600 GHz, atmost 500 GHz, at most 400 GHz, at most 300 GHz, and/or at most 200 GHz.

The proximity of VNA extender 160 to DUT 42, when compared to theproximity of controller 90 to the DUT, may permit and/or facilitate theincrease in the frequency of the test signal. As such, it may bedesirable to position VNA extender 160 as close to DUT 42 as possible,and probe systems 20 may be configured to facilitate this closeproximity between the VNA extender and the probe. As an example, datacable 80 may define a first signal transmission length betweencontroller 90 and VNA extender 160, and probe system 20 also may definea second signal transmission length between VNA extender 160 and a probetip 174 of probe 170. Under these conditions, probe system 20 may beconfigured such that the second signal transmission length is less thana threshold fraction of the first signal transmission length. Examplesof the threshold fraction include threshold fractions of less than 10%,less than 5%, less than 1%, less than 0.5%, less than 0.1%, less than0.05%, or less than 0.01% of the first signal transmission length.

It is within the scope of the present disclosure that probe headassembly 100 further may include additional structure and/or structuresthat may be utilized to move VNA extender 160 closer to DUT 42, todecrease a distance between the VNA extender and the DUT, and/or todecrease the second signal transmission length. As an example, and asillustrated in dashed lines in FIG. 1 and in solid lines in FIGS. 2-5,probe head assembly 100 may include a VNA extender mounting plate 150.VNA extender mounting plate 150 may be operatively, or even directly,attached to probe mount 126, and VNA extender 160 may be operatively, oreven directly, attached to the probe mount via the VNA extender mountingplate. Additionally or alternatively, VNA extender 160 may beoperatively attached to a surface of VNA extender mounting plate 150that faces toward support surface 32 of chuck 30 and/or toward DUT 42.Stated another way, VNA extender 160 may extend at least partiallybetween VNA extender mounting plate 150 and support surface 32 and/orDUT 42.

In such a configuration, and as illustrated, VNA extender 160 may bepositioned in close proximity to platen 110 and/or may be positioned inclose proximity to, or even over, an aperture 112 within platen 110.This may decrease a distance between the VNA extender and the DUT and/ordecrease a length of the second signal transmission length that isneeded to electrically interconnect the VNA extender and the DUT whencompared to probe systems that are not configured as illustrated inFIGS. 1-5.

As illustrated, VNA extender mounting plate 150 may be directly and/oroperatively attached to probe mount 126. Similarly, VNA extender 160 maybe directly and/or operatively attached to VNA extender mounting plate150. In addition, probe 170 may be directly and/or operatively attachedto VNA extender 160.

As illustrated in dashed lines in FIG. 1, and in solid lines in FIGS.2-5, probe 170 may include a waveguide 180. Waveguide 180, when present,may extend between, may electrically interconnect, and/or maymechanically interconnect VNA extender 160 and probe 170 and/or a probetip 174 of probe 170. Waveguide 180 may be a rigid, or at leastsubstantially rigid, waveguide 180 that maintains a fixed, or at leastsubstantially fixed, relative orientation between probe tip 174 and VNAextender 160, and manipulator 120 may be configured to selectively andoperatively translate waveguide 180 relative to manipulator mount 124via motion of probe mount 126.

As illustrated schematically in dashed lines in FIG. 1 and lessschematically in solid lines in FIGS. 2-3, probe system 20 may include ameasurement device 190. Measurement device 190, when present, may beadapted, configured, designed, sized, and/or constructed to detect,measure, directly detect, and/or directly measure a distance betweenfirst manipulated assembly 141 and second manipulated assembly 142. Ingeneral, the distance between the first manipulated assembly and thesecond manipulated assembly may be measured in a direction that isparallel, or at least substantially parallel, to an upper surface 41 ofsubstrate 40, as illustrated in FIG. 1.

This may include measuring any suitable distance between any suitableportion, component, and/or region of the first manipulated assembly andany suitable portion, component, and/or region of the second manipulatedassembly. Examples of suitable components of the first manipulatedassembly and/or of the second manipulated assembly include one or moreof VNA extender mounting plate 150, VNA extender 160, probe 170, probetip 174, and/or waveguide 180. As an example, measurement device 190 maymeasure the distance between probe 170 of first manipulated assembly 141and probe 170 of second manipulated assembly 142. As another example,and when manipulated assemblies 140 include VNA extender mounting plates150, measurement device 190 may measure the distance between VNAextender mounting plate 150 of first manipulated assembly 141 and VNAextender mounting plate 150 of second manipulated assembly 142.

Measurement device 190 may include any suitable structure. As examples,measurement device 190 may include one or more of a micrometer, acaliper, a capacitive probe, an optical encoder, and/or aninterferometer. As another example, measurement device 190 may include,or be, an electronic measurement device. As yet another example, and asillustrated in FIG. 1, measurement device 190 may include a display 192configured to indicate the distance between the first manipulatedassembly and the second manipulated assembly.

Measurement device 190 may measure the distance between firstmanipulated assembly 141 and second manipulated assembly 142 in anysuitable manner. As an example, and as illustrated in FIG. 1, firstmanipulated assembly 141 may include a measurement device mount 194, andmeasurement device 190 may be operatively attached, or mounted, to themeasurement device mount. In addition, second manipulated assembly 142may include a striker surface 196, and measurement device 190 may beconfigured to operatively contact striker surface 196 to measure thedistance between the first manipulated assembly and the secondmanipulated assembly. Additionally or alternatively, and as illustratedin FIGS. 1-3, striker surface 196 may be operatively attached to thesecond manipulated assembly, such as via a corresponding measurementdevice mount 194. Thus, the distance between the first manipulatedassembly and the second manipulated assembly may include, be, and/or bebased upon, the distance between the measurement device mount and thestriker surface.

It is within the scope of the present disclosure that measurement device190 may extend between and/or operatively contact both first manipulatedassembly 141 and second manipulated assembly 142. As an example,measurement device mount 194 may operatively attach the measurementdevice, or at least a portion of the measurement device, to firstmanipulated assembly 141 and/or to second manipulated assembly 142.Examples of measurement device mount 194 include any suitable mechanicalmount, fastener, fastening assembly, vacuum surface, and/or vacuummount.

However, this is not required. As an example, and as discussed,measurement device 190 may include an interferometer and/or anotherlight-based, or laser-based, measurement device. Under these conditions,measurement device 190 need not physically touch first manipulatedassembly 141 and/or second manipulated assembly 142 but still willquantify the distance between the first manipulated assembly and thesecond manipulated assembly.

Measurement device 190 may include and/or be a single measurementdevice. Additionally or alternatively, measurement device 190 may not beintegral with first manipulator 121 and/or second manipulator 122. Sucha configuration may improve measurement accuracy over a system that, forexample, measures motion of first manipulator 121, separately measuresmotion of second manipulator 122, and indirectly calculates the distancebetween the first manipulated assembly and the second manipulatedassembly based upon these distinct and/or independent measurements.

It is within the scope of the present disclosure that the distancebetween the first manipulated assembly and the second manipulatedassembly may include, or be, any suitable distance that isrepresentative of an absolute, or relative, distance between probe tip174 of first probe 171 and probe tip 174 of second probe 172. As anexample, the distance may be a direct measure of the distance betweenthe probe tips. As another example, the distance may be an indirectmeasure of the distance between the probe tips. As yet another example,the distance may not necessarily be the absolute distance between theprobe tips but instead may be a relative measure of the relativedistance between the probe tips, and such a relative measure may beutilized to determine, establish, and/or quantify changes in thedistance between the probe tips.

As discussed herein, probe systems 20 may include controller 90. Whenprobe systems 20 include both controller 90 and measurement device 190,measurement device 190 may be configured to generate a distance signal199, which may be indicative of the distance between the firstmanipulated assembly and the second manipulated assembly. Under theseconditions, probe systems 20 further may include a signal conveyancestructure 198, which may be configured to convey the distance signalfrom the measurement device to the controller. Examples of the signalconveyance structure include any suitable signal conveyance wire, signalconveyance fiber optic cable, wired signal conveyance structure, and/orwireless signal conveyance structure. Controller 90, when present, maybe adapted, configured, and/or programmed to control the operation ofprobe systems 20, such as by performing any suitable portion of methods300, which are discussed in more detail herein with reference to FIG. 6.This control may be based, at least in part, on distance signal 199.

Probe systems 20 that include measurement device 190 may provide severalbenefits over conventional probe systems, which do not measure, or atleast directly measure, the distance between the first manipulatedassembly and the second manipulated assembly. As an example, and undercertain conditions, it may be desirable to accurately know, or quantify,the distance between probe tips 174 that are utilized to contact firstcontact location 46 and second contact location 48 of test structure 44that is illustrated in FIG. 1. Additionally or alternatively, it alsomay be desirable to maintain the distance between probe tips 174 over aseries of measurements, at a series of different measurementtemperatures, and/or despite thermal drift of probe systems 20. Underthese conditions, probe systems 20, which are disclosed herein, maypermit more accurate measurement of the distance between the probe tipsand/or may permit the probe tips to be more accurately maintained at adesired separation distance when compared to more conventional probesystems.

As a more specific example, and prior to performing millimeter wave(mmW) measurements, a probe system may be calibrated by contacting aseries of different test structures 44, such as a thru, an open, ashort, an electrically conductive trace, and/or a series of lines withprecisely known dimensions. Under these conditions, it may be beneficialto maintain the distance between the probe tips fixed, or at leastsubstantially fixed, and/or to account for variations in the distancebetween the probe tips as the probe tips are utilized to contact thevarious test structures, and probe systems 20 may permit and/orfacilitate improved calibration via direct measurement of the distancebetween the probe tips utilizing measurement device 190.

Manipulators 120 may include any suitable structure that may be adapted,configured, designed, and/or constructed to selectively and operativelytranslate a corresponding probe mount 126 relative to a correspondingmanipulator mount 124 and/or to selectively and operatively translate acorresponding manipulated assembly 140 relative to platen 110. Asexamples, manipulators 120 may include one or more of a manuallyactuated manipulator, a mechanically actuated manipulator, anelectrically actuated manipulator, a lead screw and nut assembly, a ballscrew and nut assembly, a rack and pinion assembly, a linear actuator, arotary actuator, and/or a stepper motor. FIGS. 2-3 illustrate firstmanipulator 121 as the manually actuated manipulator and secondmanipulator 122 as the electrically actuated manipulator. FIGS. 4-5illustrate manipulator 120 as the electrically actuated manipulator.Probe systems 20 may include any suitable combination of manually and/orelectrically actuated manipulators 120.

Manipulators 120 may be configured to provide motion in any suitabledirection. As an example, manipulators 120 may be configured toselectively and operatively translate the corresponding probe mountand/or the corresponding manipulated assembly along the X-axis, theY-axis, and/or the Z-axis of FIG. 1. Additionally or alternatively,manipulators 120 may be configured to selectively and operatively pivot,or rotate, the corresponding probe mount and/or the correspondingmanipulated assembly about the X-axis, the Y-axis, and/or the Z-axis.Such pivoting, or rotating, also may be referred to herein as yaw,pitch, and roll adjustments. The X-axis may be parallel, or at leastsubstantially parallel, to support surface 32 of chuck 30, while theY-axis may be parallel, or at least substantially parallel, to thesupport surface but perpendicular to the X-axis. The Z-axis may beperpendicular, or at least substantially perpendicular, to the X-axis,to the Y-axis, and/or to the support surface.

Probes 170, such as first probe 171 and/or second probe 172, may includeany suitable structure that may be adapted, configured, designed, and/orconstructed to operatively, electrically, and/or mechanically contactsubstrate 40, DUT 42, test structure 44, first contact location 46,and/or second contact location 48. As examples, probes 170 may includeone or more of a needle probe, a test head, and/or a probe head thatincludes a plurality of respective probes. Each probe 170 may include atleast one corresponding probe tip 174.

As illustrated in dashed lines in FIG. 1, probe systems 20 may include alower enclosure 50 and/or an upper enclosure 60. Lower enclosure 50,when present, may at least partially define and/or bound an enclosedvolume 52, and chuck 30 and/or support surface 32 thereof may bepositioned within the enclosed volume. Stated another way, lowerenclosure 50 may surround, house, and/or contain at least a portion ofchuck 30, such as a portion of chuck 30 that defines support surface 32.

Upper enclosure 60, when present, also may at least partially defineand/or bound enclosed volume 52 and may include an aperture 62.Manipulators 120 and at least a portion of manipulated assemblies 140,such as VNA extenders 160, may be external to enclosed volume 52. Inaddition, at least a portion of a given probe 170 and/or waveguide 180may extend through aperture 62 such that a corresponding probe tip 174is positioned within the enclosed volume.

FIG. 6 is a flowchart depicting examples of methods 300 of utilizing aprobe system, according to the present disclosure, such as probe system20 of FIGS. 1-5. Methods 300 include operatively aligning a first probeat 310 and operatively aligning a second probe at 320. Methods 300 alsoinclude directly measuring a distance between a first manipulatedassembly and a second manipulated assembly at 330, contacting the firstprobe with a first contact location at 340, and contacting the secondprobe with a second contact location at 350. Methods 300 further includeproviding a test signal at 360 and receiving a resultant signal at 370.Methods 300 also may include calibrating the probe system at 380,measuring a DUT at 385, and/or repeating at least a portion of themethods at 390.

Operatively aligning the first probe at 310 may include operativelyaligning the first probe, which may form a portion of a firstmanipulated assembly, with the first contact location, which may form aportion of, or be in electrical communication with, an electricalstructure, examples of which are disclosed herein. Similarly, theoperatively aligning the second probe at 320 may include operativelyaligning the second probe, which may form a portion of a secondmanipulated assembly, with the second contact location, which also mayform a portion of, or be in electrical communication with, theelectrical structure.

The operatively aligning at 310 and the operatively aligning at 320 maybe accomplished in any suitable manner. As examples, the operativelyaligning at 310 may include operatively translating the firstmanipulated assembly relative to the electrical structure with a firstmanipulator and/or operatively translating the electrical structurerelative to the first probe with a translation stage of a chuck thatsupports a substrate that includes the electrical structure.

Similarly, the operatively aligning at 320 may include operativelytranslating the second manipulated assembly relative to the electricalstructure with a second manipulator and/or operatively translating theelectrical structure relative to the second probe with the translationstage.

Directly measuring the distance between the first manipulated assemblyand the second manipulated assembly at 330 may include directlymeasuring the distance in any suitable manner. As an example, thedirectly measuring may include directly measuring with a measurementdevice, or a single measurement device, such as measurement device 190of FIGS. 1-3. As another example, the directly measuring at 330 mayinclude measuring a distance between a first predetermined portion ofthe first manipulated assembly, such as a measurement device mount, anda second predetermined portion of the second manipulated assembly, suchas a striker surface. As yet another example, the directly measuring at330 may include directly measuring in, or within, a measurement planethat is parallel, or at least substantially parallel, to a surface ofthe electrical structure that includes, or defines, the first contactlocation and the second contact location.

It is within the scope of the present disclosure that the directlymeasuring at 330 may be performed with any suitable timing and/orsequencing within methods 300. As examples, the directly measuring at330 may be performed subsequent to the operatively aligning at 310,subsequent to the operatively aligning at 320, prior to the contactingat 340, prior to the contacting at 350, subsequent to the contacting at340, and/or subsequent to the contacting at 350.

Contacting the first probe with the first contact location at 340 andcontacting the second probe with the second contact location at 350 mayinclude contacting in any suitable manner. As examples, the contactingat 340 may include physically, mechanically, and/or electricallycontacting the first probe with the first contact location, moving thefirst probe toward the first contact location, and/or moving the firstcontact location toward the first probe. Similarly, the contacting at350 may include physically, mechanically, and/or electrically contactingthe second probe with the second contact location, moving the secondprobe toward the second contact location, and/or moving the secondcontact location toward the second probe.

The contacting at 340 and/or the contacting at 350 may be performed withany suitable timing and/or sequence within methods 300. As an example,the contacting at 340 may be subsequent to the operatively aligning thefirst probe with the first contact location. Similarly, the contactingat 350 may be subsequent to the operatively aligning the second probewith the second contact location.

Providing the test signal at 360 may include providing any suitable testsignal to the electrical structure through, via, and/or utilizing thefirst probe and/or the second probe. As examples, the providing at 360may include providing the test signal at a test signal frequency of atleast 50 GHz, at least 60 GHz, at least 80 GHz, at least 100 GHz, atleast 150 GHz, at least 200 GHz, at most 1,000 GHz, at most 800 GHz, atmost 600 GHz, at most 500 GHz, at most 400 GHz, at most 300 GHz, and/orat most 200 GHz. Additionally or alternatively, the providing at 360 mayinclude providing the test signal from a test signal generation andanalysis assembly, providing the test signal from a vector networkanalyzer, and/or providing the test signal from a vector networkanalyzer extender.

The providing at 360 may be performed with any suitable timing and/orsequence during methods 300. As examples, the providing at 360 may beperformed subsequent to the contacting the first probe with the firstcontact location at 340 and/or subsequent to the contacting the secondprobe with the second contact location at 350.

Receiving the resultant signal at 370 may include receiving any suitableresultant signal from the electrical structure through, via, and/orutilizing the first probe and/or the second probe. As examples, thereceiving at 370 may include receiving the resultant signal at aresultant signal frequency of at least 50 GHz, at least 60 GHz, at least80 GHz, at least 100 GHz, at least 150 GHz, at least 200 GHz, at most1,000 GHz, at most 800 GHz, at most 600 GHz, at most 500 GHz, at most400 GHz, at most 300 GHz, and/or at most 200 GHz. Additionally oralternatively, the receiving at 370 may include receiving the resultantsignal with a test signal generation and analysis assembly, receivingthe resultant signal with a vector network analyzer, and/or receivingthe resultant signal with a vector network analyzer extender.

The receiving at 370 may be performed with any suitable timing and/orsequence during methods 300. As examples, the receiving at 370 may beperformed subsequent to the contacting the first probe with the firstcontact location, subsequent to the contacting the second probe with thesecond contact location, subsequent to the providing at 360, and/orresponsive to the providing at 360.

Calibrating the probe system at 380 also may be referred to herein ascharacterizing the probe system at 380. During the calibrating at 380,the electrical structure may include, or be, a test structure, and thecalibrating may include calibrating the probe system based, at least inpart, on a configuration of the test structure, on the test signal thatwas provided during the providing at 360, on the resultant signal thatwas received during the receiving at 370, and/or on the distance betweenthe first manipulated assembly and the second manipulated assembly thatwas measured during the directly measuring at 330. The calibrating at380 may include calibrating in any suitable manner.

As an example, the calibrating at 380 may include utilizing the distancethat was measured during the directly measuring at 330 as an input to amathematical algorithm that is utilized to calibrate the probe system.As a more specific example, the calibrating at 380 may includeperforming a controlled electrical measurement on one or more predefinedtest structures, such as to characterize an S-parameter of the probesystem. Such a calibration subsequently may be utilized, such as duringthe measuring at 385, to more accurately measure one or morecharacteristics of a DUT and/or to deconvolute, separate, and/or filterout, the impact of the probe system on the measurement that is performedduring the measuring at 385, thereby permitting more accuratecharacterization of the DUT. Under these conditions, the distance thatis determined during the measuring at 330 may be utilized, by the probesystem, to more accurately characterize, determine, and/or calculate theS-parameter of the probe system.

As another more specific example, the controlled electrical measurementmay be part of a Thru, Reflect, Line (TRL) measurement in which twotransmission standards and one reflection standard may be measured todetermine 2-port 12-term error coefficients for the probe system. Duringthe TRL measurements, a thru test structure, an open test structure, anda short test structure may be measured. In addition, a series oftransmission lines of known dimensions and varying length also may bemeasured. Measurement of these test structures and transmission linesmay require that the distance between the first probe and the secondprobe be adjusted in order to measure the different transmission lines,and the accuracy of the resultant calibration of the probe system isimpacted significantly by the distance between the first probe and thesecond probe during each measurement. Stated another way, accurateknowledge of the distance between the first probe and the second probe,such as may be provided during the measuring at 330, may permit theprobe system to be more accurately calibrated. With this in mind, thecalibrating at 380 may include adjusting the calibration of the probesystem, adjusting the calculation of the S-parameter, and/or adjustingthe calculation of the 2-port 12-term error coefficients based, at leastin part, on the distance that is measured during the measuring at 330.In one example, such an adjustment may include accounting fordifferences between an actual distance between the first probe and thesecond probe and a desired, or theoretical, distance between the firstprobe and the second probe based, at least in part, on the measuring at330.

As another example, and prior to the contacting at 340 and/or prior tothe contacting at 350, the calibrating at 380 may include adjusting thedistance between the first manipulated assembly and the secondmanipulated assembly. This may include adjusting to maintain thedistance between the first manipulated assembly and the secondmanipulated assembly within a predetermined, desired, or target distancerange subsequent to the contacting at 340 and also subsequent to thecontacting at 350.

When the calibrating at 380 includes adjusting the distance between thefirst manipulated assembly and the second manipulated assembly, theadjusting may be performed in any suitable manner. As examples, theadjusting may include operatively translating the first manipulatedassembly and/or operatively translating the second manipulated assembly.As additional examples, the adjusting may include manually adjusting,such as by a user of the probe system, and/or automatically adjusting,such as via an electronically controlled, or motorized, manipulator.

When the adjusting includes manually adjusting, methods 300 further mayinclude displaying a distance offset, and the manually adjusting may bebased, at least in part, on the distance offset. Examples of thedistance offset include a distance between the first manipulatedassembly and the second manipulated assembly and/or a difference betweenthe distance between the first manipulated assembly and the secondmanipulated assembly and a desired distance between the firstmanipulated assembly and the second manipulated assembly.

The calibrating at 380 may be performed with any suitable timing and/orsequence during methods 300. As examples, the calibrating at 380 may beperformed prior to the contacting at 340 and/or prior to the contactingat 350, such as when the calibrating at 380 includes adjusting thedistance between the first manipulated assembly and the secondmanipulated assembly. As additional examples, the calibrating at 380 maybe performed subsequent to the contacting at 340, subsequent to thecontacting at 350, subsequent to the providing at 360, and/or subsequentto the receiving at 370, such as when the calibrating at 380 includesutilizing the distance between the first manipulated assembly and thesecond manipulated assembly as the input to the mathematical algorithm.

Measuring the DUT at 385 also may be referred to herein ascharacterizing the electrical structure at 385. During the measuring at385, the electrical structure may include, or be, a DUT, and themeasuring at 385 may include measuring any suitable property and/orcharacteristic of the DUT. As an example, the measuring at 385 mayinclude measuring to determine, establish, and/or calculate theS-parameter of the DUT. Under these conditions, the measuring at 385 maybe performed subsequent to the calibrating at 380 such that theS-parameter of the DUT may be deconvoluted from the S-parameter of theprobe system, such that the S-parameter of the DUT may be quantifiedindependently from any impact that the probe system has upon the datathat is collected during the measuring at 385, and/or such that theS-parameter of the probe system is known prior to measuring the DUT.

It is within the scope of the present disclosure that the measuring at385 may be based, at least in part, on the measuring at 330. As anexample, the measuring at 330 may be utilized to mathematically account,or adjust, for variations in results obtained, during the measuring at385, that may be caused by variations in the distance between the firstprobe and the second probe. As another example, the measuring at 330 maybe utilized to adjust the distance between the first probe and thesecond probe, such as is discussed herein with reference to thecalibrating at 380, in order to maintain the distance between the firstprobe and the second probe within a predetermined distance range duringthe measuring at 385.

Repeating at least the portion of the methods at 390 may includerepeating any suitable portion, or step, of methods 300 in any suitablemanner and/or in any suitable order. As an example, the electricalstructure may be a first electrical structure, the test signal may be afirst test signal, the resultant signal may be a first resultant signal,and the distance may be a first distance. Under these conditions, therepeating at 390 may include repeating the method a plurality of timesto provide a plurality of respective test signals to a plurality ofrespective electrical structures and to receive a correspondingplurality of resultant signals from the respective plurality ofelectrical structures. Under these conditions, the repeating at 390further may include performing the calibrating at 380 based upon aconfiguration of each of the respective test structures, the pluralityof respective test signals, the plurality of respective resultantsignals, and the plurality of respective distances.

As another example, and as discussed, the calibrating at 380 may beutilized to characterize the S-parameter of the probe system. Underthese conditions, and subsequent to calibration of the probe system, therepeating at 390 may include repeating at least the operatively aligningat 310, the operatively aligning at 320, the directly measuring at 330,the contacting at 340, the contacting at 350, the providing at 360, andthe receiving at 370 on a DUT, such as to permit the measuring at 385 tobe performed accurately and/or to permit the contribution of the probesystem to be deconvoluted from the contribution of the DUT.

In the present disclosure, several of the illustrative, non-exclusiveexamples have been discussed and/or presented in the context of flowdiagrams, or flow charts, in which the methods are shown and describedas a series of blocks, or steps. Unless specifically set forth in theaccompanying description, it is within the scope of the presentdisclosure that the order of the blocks may vary from the illustratedorder in the flow diagram, including with two or more of the blocks (orsteps) occurring in a different order and/or concurrently. It also iswithin the scope of the present disclosure that the blocks, or steps,may be implemented as logic, which also may be described as implementingthe blocks, or steps, as logics. In some applications, the blocks, orsteps, may represent expressions and/or actions to be performed byfunctionally equivalent circuits or other logic devices. The illustratedblocks may, but are not required to, represent executable instructionsthat cause a computer, processor, and/or other logic device to respond,to perform an action, to change states, to generate an output ordisplay, and/or to make decisions.

As used herein, the term “and/or” placed between a first entity and asecond entity means one of (1) the first entity, (2) the second entity,and (3) the first entity and the second entity. Multiple entities listedwith “and/or” should be construed in the same manner, i.e., “one ormore” of the entities so conjoined. Other entities may optionally bepresent other than the entities specifically identified by the “and/or”clause, whether related or unrelated to those entities specificallyidentified. Thus, as a non-limiting example, a reference to “A and/orB,” when used in conjunction with open-ended language such as“comprising” may refer, in one embodiment, to A only (optionallyincluding entities other than B); in another embodiment, to B only(optionally including entities other than A); in yet another embodiment,to both A and B (optionally including other entities). These entitiesmay refer to elements, actions, structures, steps, operations, values,and the like.

As used herein, the phrase “at least one,” in reference to a list of oneor more entities should be understood to mean at least one entityselected from any one or more of the entities in the list of entities,but not necessarily including at least one of each and every entityspecifically listed within the list of entities and not excluding anycombinations of entities in the list of entities. This definition alsoallows that entities may optionally be present other than the entitiesspecifically identified within the list of entities to which the phrase“at least one” refers, whether related or unrelated to those entitiesspecifically identified. Thus, as a non-limiting example, “at least oneof A and B” (or, equivalently, “at least one of A or B,” or,equivalently “at least one of A and/or B”) may refer, in one embodiment,to at least one, optionally including more than one, A, with no Bpresent (and optionally including entities other than B); in anotherembodiment, to at least one, optionally including more than one, B, withno A present (and optionally including entities other than A); in yetanother embodiment, to at least one, optionally including more than one,A, and at least one, optionally including more than one, B (andoptionally including other entities). In other words, the phrases “atleast one,” “one or more,” and “and/or” are open-ended expressions thatare both conjunctive and disjunctive in operation. For example, each ofthe expressions “at least one of A, B, and C,” “at least one of A, B, orC,” “one or more of A, B, and C,” “one or more of A, B, or C,” and “A,B, and/or C” may mean A alone, B alone, C alone, A and B together, A andC together, B, and C together, A, B and C together, and optionally anyof the above in combination with at least one other entity.

In the event that any patents, patent applications, or other referencesare incorporated by reference herein and (1) define a term in a mannerthat is inconsistent with and/or (2) are otherwise inconsistent with,either the non-incorporated portion of the present disclosure or any ofthe other incorporated references, the non-incorporated portion of thepresent disclosure shall control, and the term or incorporateddisclosure therein shall only control with respect to the reference inwhich the term is defined and/or the incorporated disclosure was presentoriginally.

As used herein the terms “adapted” and “configured” mean that theelement, component, or other subject matter is designed and/or intendedto perform a given function. Thus, the use of the terms “adapted” and“configured” should not be construed to mean that a given element,component, or other subject matter is simply “capable of” performing agiven function but that the element, component, and/or other subjectmatter is specifically selected, created, implemented, utilized,programmed, and/or designed for the purpose of performing the function.It also is within the scope of the present disclosure that elements,components, and/or other recited subject matter that is recited as beingadapted to perform a particular function may additionally oralternatively be described as being configured to perform that function,and vice versa.

As used herein, the phrase, “for example,” the phrase, “as an example,”and/or simply the term “example,” when used with reference to one ormore components, features, details, structures, embodiments, and/ormethods according to the present disclosure, are intended to convey thatthe described component, feature, detail, structure, embodiment, and/ormethod is an illustrative, non-exclusive example of components,features, details, structures, embodiments, and/or methods according tothe present disclosure. Thus, the described component, feature, detail,structure, embodiment, and/or method is not intended to be limiting,required, or exclusive/exhaustive; and other components, features,details, structures, embodiments, and/or methods, including structurallyand/or functionally similar and/or equivalent components, features,details, structures, embodiments, and/or methods, also are within thescope of the present disclosure.

Illustrative, non-exclusive examples of systems and methods according tothe present disclosure are presented in the following enumeratedparagraphs. It is within the scope of the present disclosure that anindividual step of a method recited herein, including in the followingenumerated paragraphs, may additionally or alternatively be referred toas a “step for” performing the recited action.

A1. A probe system, comprising:

a probe head assembly including:

-   -   (i) a platen;    -   (ii) a manipulator including a manipulator mount, which is        operatively attached to the platen, and a probe mount,        optionally wherein the manipulator is configured to selectively        and operatively translate the probe mount relative to the        manipulator mount;    -   (iii) a vector network analyzer (VNA) extender operatively        attached to the probe mount; and    -   (iv) a probe operatively attached to the probe mount via the VNA        extender, optionally wherein the manipulator is configured to        selectively and operatively translate both the VNA extender and        the probe relative to the manipulator mount via motion of the        probe mount;

a chuck including a support surface configured to support a substratethat includes a device under test (DUT), wherein the probe faces towardthe support surface to permit selective electrical contact between theprobe and the DUT; and

a vector network analyzer configured to at least one of:

-   -   (i) provide a test signal to the probe via the VNA extender; and    -   (ii) receive a resultant signal from the probe via the VNA        extender.

A2. The probe system of paragraph A1, wherein the probe head assemblyfurther includes a VNA extender mounting plate operatively attached tothe probe mount, and further wherein the VNA extender is operativelyattached to the probe mount via the VNA extender mounting plate.

A3. The probe system of paragraph A2, wherein the VNA extender isoperatively attached to a surface of the VNA extender mounting platethat faces toward the support surface.

A4. The probe system of any of paragraphs A2-A3, wherein the VNAextender extends at least partially between the VNA extender mountingplate and the support surface.

A5. The probe system of any of paragraphs A1-A4, wherein the VNAextender mounting plate is directly attached to the probe mount.

A6. The probe system of any of paragraphs A1-A5, wherein the VNAextender is directly attached to a/the VNA extender mounting plate.

A7. The probe system of any of paragraphs A1-A6, wherein the probe isdirectly attached to the VNA extender.

A8. The probe system of any of paragraphs A1-A7, wherein the probesystem further includes a waveguide that extends between andelectrically and mechanically interconnects the VNA extender and theprobe.

A9. The probe system of paragraph A8, wherein the manipulator isconfigured to selectively and operatively translate the waveguiderelative to the manipulator mount via motion of the probe mount.

A10. The probe system of any of paragraphs A1-A9, wherein themanipulator is configured to operatively translate the probe mountrelative to the manipulator mount along at least one, optionally atleast two, and further optionally all three of an X-axis, a Y-axis, anda Z-axis optionally wherein at least one of:

-   -   (i) the X-axis is parallel, or at least substantially parallel,        to the support surface;    -   (ii) the Y-axis is parallel, or at least substantially parallel,        to the support surface and perpendicular, or at least        substantially perpendicular, to the X-axis; and    -   (iii) the Z-axis is perpendicular, or at least substantially        perpendicular, to at least one, optionally at least two, and        further optionally all three of the X-axis, the Y-axis, and the        support surface.

A11. The probe system of paragraph A10, wherein the manipulator furtheris configured to pivot the probe mount relative to the manipulator mountabout at least one, optionally at least two, and further optionally allthree of the X-axis, the Y-axis, and the Z-axis.

A12. The probe system of any of paragraphs A1-A11, wherein themanipulator includes at least one of:

(i) a manually actuated manipulator; and

(ii) an electrically actuated manipulator.

A13. The probe system of any of paragraphs A1-A12, wherein the probesystem further includes a data cable that electrically interconnects thevector network analyzer and the VNA extender.

A14. The probe system of paragraph A13, wherein the data cable defines afirst signal transmission length between the vector network analyzer andthe VNA extender, wherein the probe system further defines a secondsignal transmission length between the VNA extender and a probe tip ofthe probe, and further wherein the second signal transmission length isless than a threshold fraction of the first signal transmission length.

A15. The probe system of paragraph A14, wherein the threshold fractionis less than 10%, less than 5%, less than 1%, less than 0.5%, less than0.1%, less than 0.05%, or less than 0.01% of the first signaltransmission length.

A16. The probe system of any of paragraphs A1-A15, wherein the VNAextender is configured to receive the test signal from the vectornetwork analyzer at a first frequency and to provide the test signal tothe probe at a second frequency that is greater than the firstfrequency.

A17. The probe system of paragraph A16, wherein the first frequency isat most 10 gigahertz (GHz), at most 20 GHz, at most 30 GHz, at most 40GHz, at most 50 GHz, at most 60 GHz, at most 70 GHz, or at most 80 GHz.

A18. The probe system of any of paragraphs A16-A17, wherein the secondfrequency is at least one of:

(i) at least 50 GHz, at least 60 GHz, at least 70 GHz, at least 80 GHz,at least 90 GHz, at least 100 GHz, at least 200 GHz, or at least 300GHz; and

(ii) at most 1,000 GHz, at most 800 GHz, at most 600 GHz, at most 500GHz, at most 400 GHz, at most 300 GHz, or at most 200 GHz.

A19. The probe system of any of paragraphs A1-A18, wherein the probesystem further includes a lower enclosure at least partially defining anenclosed volume, wherein the support surface is positioned within theenclosed volume.

A20. The probe system of paragraph A19, wherein the probe system furtherincludes an upper enclosure at least partially defining the enclosedvolume, wherein the upper enclosure includes an aperture, wherein themanipulator and the VNA extender are external to the enclosed volume,and further wherein the probe extends through the aperture such that theprobe tip of the probe is positioned within the enclosed volume.

B1. A probe system, comprising:

a chuck including a support surface configured to support a substratethat includes a device under test (DUT);

a probe head assembly, including:

(i) a platen;

(ii) a first manipulator operatively attached to the platen;

(iii) a first manipulated assembly including a first probe configured tocontact the DUT, wherein the first manipulated assembly is operativelyattached to the first manipulator and optionally configured tooperatively translate relative to the platen via actuation of the firstmanipulator;

(iv) a second manipulator operatively attached to the platen; and

(v) a second manipulated assembly including a second probe configured tocontact the DUT, wherein the second manipulated assembly is operativelyattached to the second manipulator and optionally configured tooperatively translate relative to the platen via actuation of the secondmanipulator, optionally wherein the first manipulator and the secondmanipulator are configured to be independently actuated to operativelytranslate the first manipulated assembly and the second manipulatedassembly relative to one another; and

a measurement device configured to directly measure a distance betweenthe first manipulated assembly and the second manipulated assembly.

B2. The probe system of paragraph B1, wherein the measurement deviceincludes at least one of:

(i) a micrometer;

(ii) a capacitive probe; and

(iii) an interferometer.

B3. The probe system of any of paragraphs B1-B2, wherein the measurementdevice is an electronic measurement device.

B4. The probe system of any of paragraphs B1-B3, wherein the measurementdevice includes a display configured to indicate the distance betweenthe first manipulated assembly and the second manipulated assembly.

B5. The probe system of any of paragraphs B1-B4, wherein the firstmanipulated assembly includes a measurement device mount, wherein themeasurement device is operatively attached to the measurement devicemount.

B6. The probe system of paragraph B5, wherein the second manipulatedassembly includes a striker surface, wherein the measurement device isconfigured to operatively contact the striker surface to measure thedistance between the first manipulated assembly and the secondmanipulated assembly, optionally wherein the distance between the firstmanipulated assembly and the second manipulated assembly includes, isbased upon, or is, a distance between the measurement device mount andthe striker surface.

B7. The probe system of any of paragraphs B1-B6, wherein the measurementdevice extends between, and operatively contacts, both the firstmanipulated assembly and the second manipulated assembly.

B8. The probe system of any of paragraphs B1-B7, wherein the measurementdevice is a single measurement device.

B9. The probe system of any of paragraphs B1-B8, wherein the measurementdevice is not integral with either the first manipulator or the secondmanipulator.

B10. The probe system of any of paragraphs B1-B9, wherein the firstprobe includes at least one of:

(i) a first needle probe;

(ii) a first test head; and

(iii) a first probe head including a plurality of first probes.

B11. The probe system of any of paragraphs B1-B10, wherein the secondprobe includes at least one of:

(i) a second needle probe;

(ii) a second test head; and

(iii) a second probe head including a plurality of second probes.

B12. The probe system of any of paragraphs B1-B11, wherein the firstmanipulator is configured to operatively translate the first manipulatedassembly relative to the platen along at least one, optionally at leasttwo, and further optionally all three of an X-axis, a Y-axis, and aZ-axis, optionally wherein at least one of:

-   -   (i) the X-axis is parallel, or at least substantially parallel,        to the support surface;    -   (ii) the Y-axis is parallel, or at least substantially parallel,        to the support surface and perpendicular, or at least        substantially perpendicular, to the X-axis; and    -   (iii) the Z-axis is perpendicular, or at least substantially        perpendicular, to at least one, optionally at least two, and        further optionally all three of the X-axis, the Y-axis, and the        support surface.

B13. The probe system of paragraph B12, wherein the first manipulatorfurther is configured to pivot the first manipulated assembly relativeto the platen about at least one, optionally at least two, and furtheroptionally all three of the X-axis, the Y-axis, and the Z-axis.

B14. The probe system of any of paragraphs B1-B13, wherein the firstmanipulator includes at least one of:

(i) a manually actuated second manipulator; and

(ii) an electrically actuated second manipulator.

B15. The probe system of any of paragraphs B1-B14, wherein the secondmanipulator is configured to operatively translate the secondmanipulated assembly relative to the platen along at least one,optionally at least two, and further optionally all three of an/theX-axis, a/the Y-axis, and a/the Z-axis, optionally wherein at least oneof:

-   -   (i) the X-axis is parallel, or at least substantially parallel,        to the support surface;    -   (ii) the Y-axis is parallel, or at least substantially parallel,        to the support surface and perpendicular, or at least        substantially perpendicular, to the X-axis; and    -   (iii) the Z-axis is perpendicular, or at least substantially        perpendicular, to at least one, optionally at least two, and        further optionally all three of the X-axis, the Y-axis, and the        support surface.

B16. The probe system of paragraph B15, wherein the second manipulatorfurther is configured to pivot the second manipulated assembly relativeto the platen about at least one, optionally at least two, and furtheroptionally all three of the X-axis, the Y-axis, and the Z-axis.

B17. The probe system of any of paragraphs B1-B16, wherein the secondmanipulator includes at least one of:

(i) a manually actuated second manipulator; and

(ii) an electrically actuated second manipulator.

B18. The probe system of any of paragraphs B1-B17, wherein the probesystem further includes a controller programed to control the operationof at least a portion of the probe system.

B19. The probe system of paragraph B18, wherein the measurement devicefurther is configured to generate a distance signal indicative of thedistance between the first manipulated assembly and the secondmanipulated assembly and to provide the distance signal to thecontroller.

B20. The probe system of paragraph B19, wherein the probe system furtherincludes a signal conveyance structure configured to convey the distancesignal from the measurement device to the controller, optionally whereinthe signal conveyance structure includes at least one of:

(i) a signal conveyance wire;

(ii) a signal conveyance fiber optic cable;

(iii) a wired signal conveyance structure; and

(iv) a wireless signal conveyance structure.

B21. The probe system of any of paragraphs B18-B20, wherein thecontroller is programmed to perform any suitable portion of any of themethods of any of paragraphs C1-C22.

C1. A method of utilizing a probe system, the method comprising:

operatively aligning a first probe of a first manipulated assembly witha first contact location of an electrical structure;

operatively aligning a second probe of a second manipulated assemblywith a second contact location of the electrical structure;

directly measuring, with a measurement device, a distance between thefirst manipulated assembly and the second manipulated assembly;

contacting the first probe with the first contact location;

contacting the second probe with the second contact location;

providing a test signal to the electrical structure;

receiving a resultant signal from the electrical structure; and

characterizing at least one of the probe system and the electricalstructure based, at least in part, on at least one of a configuration ofthe electrical structure, the test signal, the resultant signal, and thedistance between the first manipulated assembly and the secondmanipulated assembly.

C2. The method of paragraph C1, wherein the operatively aligning thefirst probe with the first contact location includes at least one of:

(i) operatively translating the first manipulated assembly relative tothe electrical structure with a first manipulator; and

(ii) operatively translating the electrical structure relative to thefirst probe with a translation stage of a chuck that supports asubstrate that includes the electrical structure.

C3. The method of any of paragraphs C1-C2, wherein the operativelyaligning the second probe with the second contact location includes atleast one of:

(i) operatively translating the second manipulated assembly relative tothe electrical structure with a second manipulator; and

(ii) operatively translating the electrical structure relative to thesecond probe with a/the translation stage of a/the chuck that supportsa/the substrate that includes the electrical structure.

C4. The method of any of paragraphs C1-C3, wherein the directlymeasuring includes measuring a distance between a first predeterminedportion of the first manipulated assembly and a second predeterminedportion of the second manipulated assembly.

C5. The method of any of paragraphs C1-C4, wherein the directlymeasuring includes directly measuring in a measurement plane that isparallel, or at least substantially parallel, to a surface of theelectrical structure that includes the first contact location and thesecond contact location.

C6. The method of any of paragraphs C1-C5, wherein the contacting thefirst probe with the first contact location includes at least one of:

(i) physically contacting the first probe with the first contactlocation;

(ii) mechanically contacting the first probe with the first contactlocation;

(iii) electrically contacting the first probe with the first contactlocation;

(iv) moving the first probe toward the first contact location; and

(v) moving the first contact location toward the first probe.

C7. The method of any of paragraphs C1-C6, wherein the contacting thesecond probe with the second contact location includes at least one of:

(i) physically contacting the second probe with the second contactlocation;

(ii) mechanically contacting the second probe with the second contactlocation;

(iii) electrically contacting the second probe with the second contactlocation;

(iv) moving the second probe toward the second contact location; and

(v) moving the second contact location toward the second probe.

C8. The method of any of paragraphs C1-C7, wherein the providing thetest signal includes at least one of:

(i) providing the test signal at a test signal frequency of at least 50GHz, at least 60 GHz, at least 80 GHz, at least 100 GHz, at least 150GHz, or at least 200 GHz;

(ii) providing the test signal at a test signal frequency of at most1,000 GHz, at most 800 GHz, at most 600 GHz, at most 500 GHz, at most400 GHz, at most 300 GHz, or at most 200 GHz;

(iii) providing the test signal from a test signal generation andanalysis assembly;

(iv) providing the test signal from a vector network analyzer;

(v) providing the test signal from a vector network analyzer extender;

(vi) providing the test signal with the first probe; and

(vii) providing the test signal with the second probe.

C9. The method of any of paragraphs C1-C8, wherein the receiving theresultant signal includes at least one of:

(i) receiving the resultant signal at a resultant signal frequency of atleast 50 GHz, at least 60 GHz, at least 80 GHz, at least 100 GHz, atleast 150 GHz, or at least 200 GHz;

(ii) receiving the resultant signal at a resultant signal frequency ofat most 1,000 GHz, at most 800 GHz, at most 600 GHz, at most 500 GHz, atmost 400 GHz, at most 300 GHz, or at most 200 GHz;

(iii) receiving the resultant signal with a test signal generation andanalysis assembly;

(iv) receiving the resultant signal with a vector network analyzer;

(v) receiving the resultant signal with a vector network analyzerextender;

(vi) receiving the resultant signal with the first probe; and

(vii) receiving the resultant signal with the second probe.

C10. The method of any of paragraphs C1-C9, wherein the characterizingincludes calibrating the probe system.

C10.1 The method of paragraph C10, wherein the calibrating includesutilizing the distance between the first manipulated assembly and thesecond manipulated assembly as an input to a mathematical algorithmutilized to calibrate the probe system.

C11. The method of any of paragraphs C10-C10.1, wherein the calibratingincludes adjusting, prior to the contacting the first probe with thefirst contact location and also prior to the contacting the second probewith the second contact location, the distance between the firstmanipulated assembly and the second manipulated assembly to maintain thedistance between the first manipulated assembly and the secondmanipulated assembly within a predetermined threshold distance rangesubsequent to the contacting the first probe with the first contactlocation and also subsequent to the contacting the second probe with thesecond contact location.

C12. The method of paragraph C11, wherein the adjusting includes atleast one of:

(i) operatively translating the first manipulated assembly; and

(ii) operatively translating the second manipulated assembly.

C13. The method of any of paragraphs C11-C12, wherein the adjustingincludes automatically adjusting utilizing at least one motorizedmanipulator.

C14. The method of any of paragraphs C11-C13, wherein the adjustingincludes manually adjusting.

C15. The method of paragraph C14, wherein the method further includesdisplaying a distance offset, wherein the manually adjusting includesmanually adjusting based, at least in part, on the distance offset, andfurther wherein the distance offset includes at least one of:

(i) the distance between the first manipulated assembly and the secondmanipulated assembly; and

(ii) a difference between the distance between the first manipulatedassembly and the second manipulated assembly and a desired distancebetween the first manipulated assembly and the second manipulatedassembly.

C16. The method of any of paragraphs C1-C15, wherein the directlymeasuring at least one of:

(i) is performed subsequent to the operatively aligning the first probe;

(ii) is performed subsequent to the operatively aligning the secondprobe;

(iii) is performed prior to the contacting the first probe;

(iv) is performed prior to the contacting the second probe;

(v) is performed subsequent to the contacting the first probe; and

(vi) is performed subsequent to the contacting the second probe.

C17. The method of any of paragraphs C1-C16, wherein at least one of:

(i) the contacting the first probe with the first contact location issubsequent to the operatively aligning the first probe with the firstcontact location; and

(ii) the contacting the second probe with the second contact location issubsequent to the operatively aligning the second probe with the secondcontact location.

C18. The method of any of paragraphs C1-C17, wherein the providing thetest signal is subsequent to the contacting the first probe with thefirst contact location and also subsequent to the contacting the secondprobe with the second contact location.

C19. The method of any of paragraphs C1-C18, wherein the utilizing isprior to at least one, and optionally both, of the contacting the firstprobe with the first contact location and the contacting the secondprobe with the second contact location.

C20. The method of any of paragraphs C1-C19, wherein the utilizing issubsequent to at least one, and optionally both, of the contacting thefirst probe with the first contact location and the contacting thesecond probe with the second contact location.

C21. The method of any of paragraphs C1-C20, wherein the electricalstructure includes at least one of an open test structure, a short teststructure, a thru test structure, an electrically conductive trace, orline, and a device under test, or DUT.

C22. The method of any of paragraphs C1-C21, wherein the electricalstructure is a first electrical structure, wherein the test signal is afirst test signal, wherein the distance is a first distance, wherein theresultant signal is a first resultant signal, and further wherein themethod includes repeating the method a plurality of times to provide aplurality of respective test signals to a respective plurality ofrespective electrical structures and to receive a correspondingplurality of respective resultant signals from the respective pluralityof electrical structures, wherein the utilizing is based, at least inpart, on a configuration of each of the respective plurality ofelectrical structures, the plurality of respective test signals, theplurality of respective resultant signals, and a plurality of respectivedistances between the first manipulated assembly and the secondmanipulated assembly.

C23. The method of any of paragraphs C1-C22, wherein the method isperformed utilizing the probe system of any of paragraphs B1-B21.

INDUSTRIAL APPLICABILITY

The probe systems and methods disclosed herein are applicable to thesemiconductor manufacturing and test industries.

It is believed that the disclosure set forth above encompasses multipledistinct inventions with independent utility. While each of theseinventions has been disclosed in its preferred form, the specificembodiments thereof as disclosed and illustrated herein are not to beconsidered in a limiting sense as numerous variations are possible. Thesubject matter of the inventions includes all novel and non-obviouscombinations and subcombinations of the various elements, features,functions and/or properties disclosed herein. Similarly, where theclaims recite “a” or “a first” element or the equivalent thereof, suchclaims should be understood to include incorporation of one or more suchelements, neither requiring nor excluding two or more such elements.

It is believed that the following claims particularly point out certaincombinations and subcombinations that are directed to one of thedisclosed inventions and are novel and non-obvious. Inventions embodiedin other combinations and subcombinations of features, functions,elements and/or properties may be claimed through amendment of thepresent claims or presentation of new claims in this or a relatedapplication. Such amended or new claims, whether they are directed to adifferent invention or directed to the same invention, whetherdifferent, broader, narrower, or equal in scope to the original claims,are also regarded as included within the subject matter of theinventions of the present disclosure.

The invention claimed is:
 1. A probe system, comprising: a probe headassembly including: (i) a platen; (ii) a manipulator including amanipulator mount, which is operatively attached to the platen, and aprobe mount, wherein the manipulator is configured to selectively andoperatively translate the probe mount relative to the manipulator mount;(iii) a vector network analyzer (VNA) extender operatively attached tothe probe mount; and (iv) a probe operatively attached to the probemount via the VNA extender, wherein the manipulator is configured toselectively and operatively translate both the VNA extender and theprobe relative to the manipulator mount via motion of the probe mount; achuck including a support surface configured to support a substrate thatincludes a device under test (DUT), wherein the probe faces toward thesupport surface to permit selective electrical contact between the probeand the DUT; and a vector network analyzer configured to at least oneof: (i) provide a test signal to the probe via the VNA extender; and(ii) receive a resultant signal from the probe via the VNA extender. 2.The probe system of claim 1, wherein the probe head assembly furtherincludes a VNA extender mounting plate operatively attached to the probemount, and further wherein the VNA extender is operatively attached tothe probe mount via the VNA extender mounting plate.
 3. The probe systemof claim 2, wherein the VNA extender extends at least partially betweenthe VNA extender mounting plate and the support surface.
 4. The probesystem of claim 2, wherein the VNA extender is operatively attached to asurface of the VNA extender mounting plate that faces toward the supportsurface.
 5. The probe system of claim 2, wherein the VNA extendermounting plate is directly attached to the probe mount.
 6. The probesystem of claim 5, wherein the VNA extender is directly attached to theVNA extender mounting plate.
 7. The probe system of claim 6, wherein theprobe is directly attached to the VNA extender.
 8. The probe system ofclaim 1, wherein the probe system further includes a waveguide thatextends between and electrically and mechanically interconnects the VNAextender and the probe.
 9. The probe system of claim 8, wherein themanipulator is configured to selectively and operatively translate thewaveguide relative to the manipulator mount via motion of the probemount.
 10. The probe system of claim 1, wherein the probe system furtherincludes a data cable that electrically interconnects the vector networkanalyzer and the VNA extender.
 11. The probe system of claim 10, whereinthe data cable defines a first signal transmission length between thevector network analyzer and the VNA extender, wherein the probe systemfurther defines a second signal transmission length between the VNAextender and a probe tip of the probe, and further wherein the secondsignal transmission length is less than 10% of the first signaltransmission length.
 12. The probe system of claim 1, wherein themanipulator is configured to operatively translate the probe mountrelative to the manipulator mount along an X-axis, a Y-axis, and aZ-axis.
 13. The probe system of claim 1, wherein the VNA extender isconfigured to receive the test signal from the vector network analyzerat a first frequency and to provide the test signal to the probe at asecond frequency that is greater than the first frequency.
 14. The probesystem of claim 13, wherein the first frequency is at most 80 GHz. 15.The probe system of claim 14, wherein the second frequency is at least50 GHz and at most 1,000 GHz.
 16. The probe system of claim 1, whereinthe probe system further includes a lower enclosure at least partiallydefining an enclosed volume, wherein the support surface is positionedwithin the enclosed volume.
 17. The probe system of claim 16, whereinthe probe system further includes an upper enclosure at least partiallydefining the enclosed volume, wherein the upper enclosure includes anaperture, wherein the manipulator and the VNA extender are external tothe enclosed volume, and further wherein the probe extends through theaperture such that the probe tip of the probe is positioned within theenclosed volume.